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BORON DOPED SILICON WAFER

BORON DOPED SILICON WAFER

3500 INR/Pack
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Product Details:

  • Strength High mechanical strength
  • Purity 99.999% (5N)
  • Hardness HV 1150 (approx.)
  • Product Type Boron Doped Silicon Wafer
  • Material Monocrystalline silicon
  • Alloy No (single crystal silicon doped with boron)
  • Shape Round wafer
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BORON DOPED SILICON WAFER Price And Quantity

  • 3500 INR/Pack
  • 1 Pack

BORON DOPED SILICON WAFER Product Specifications

  • HV 1150 (approx.)
  • Dark gray/Black
  • No (single crystal silicon doped with boron)
  • Monocrystalline silicon
  • Nil/Not applicable
  • 99.999% (5N)
  • High mechanical strength
  • Silicon (Si) with Boron (B) dopant
  • Round wafer
  • Semiconductor devices, PV solar cells, MEMS, electronic components
  • Custom/Standard diameters: 2-8 inches, thickness 275-650 m
  • Boron Doped Silicon Wafer

BORON DOPED SILICON WAFER Trade Information

  • 1000-10000 Pack Per Day
  • 2-3 Days
  • All India

Product Description

Product NameSilicon Wafer 6 inch
Product CodeNCZ-WM-0012
CAS7440-21-3
Diameter (mm)6 (152.4 mm), also available in 2, 3, 4, 5, 12
TypeP Type /Customization possible
DopingBoron/Customization possible
Crystal Orientation<100> /other orientations are also available
SurfaceSingle/Both Side Polished
Thickness200-600 m, Ask for customization
Resistivity1-10 ohm-cm
Crystal methodCZ
RRG (%)12
Oxygen Contents (ppm)12.5-16.5
Carbon Contents (ppm)1


Superior Customization for Advanced Applications

Our boron-doped silicon wafers are engineered for flexibility, allowing customization in resistivity, thickness, carrier concentration, crystal orientation, and more. Whether your requirements are for semiconductor, photovoltaic, or MEMS technologies, our wafers deliver optimal material characteristics to suit your process demands.


Unmatched Purity and Defect Control

Crafted from monocrystalline silicon with 99.999% purity, each wafer undergoes rigorous inspection to ensure low defect density and consistency. The wafers high hardness and mechanical strength make it ideal for demanding device fabrication and long-term durability.


Comprehensive Supply and Support in India

As a principal dealer, exporter, importer, manufacturer, supplier, and wholesaler, we provide extensive product availability and support throughout India. Custom specifications, regulatory compliance, and technical guidance ensure our wafers meet and exceed industry requirements.

FAQs of BORON DOPED SILICON WAFER:


Q: How is the boron-doped silicon wafer manufactured?

A: Boron-doped silicon wafers are produced using the Czochralski (CZ) or Float Zone (FZ) process. High-purity (99.999%) silicon is doped with boron to form a p-type crystal, which is then sliced, polished, and finished to the desired thickness and surface quality.

Q: What applications are these wafers suitable for?

A: These wafers are widely used in semiconductor devices, photovoltaic (PV) solar cells, MEMS, and various electronic components that require precise electrical and structural characteristics.

Q: When should I choose <100> or <111> crystal orientation?

A: The choice between <100> and <111> orientations depends on the intended application. <100> orientation is favored for integrated circuit manufacturing due to its etching and device properties, while <111> is preferred for MEMS and certain optical devices.

Q: Where are these wafers supplied and supported?

A: We supply, manufacture, and support boron-doped silicon wafers across India, catering to both research and industrial clients with technical assistance and compliance assurance.

Q: What are the benefits of customizing wafer resistivity and carrier concentration?

A: Customizing wafer resistivity and carrier concentration ensures optimal device performance for your specific application. Precise control allows tailoring of electrical properties, enhancing efficiency and reliability in finished devices.

Q: How does the wafers high purity and low defect density impact device performance?

A: The high purity (5N) and low defect density minimize contaminant-related failures and improve the overall reliability, efficiency, and performance consistency of semiconductor and solar devices.

Q: What surface finish and edge types are available for these wafers?

A: Wafers can be supplied as single or double side polished, with either beveled or flat edge finishes. This selection provides compatibility with various downstream processes and facilitates safe handling.

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