Carbon films on Copper Grids

PVDF Powder Poly(vinylidene fluoride) Price : 750 INR/Bag Minimum Order Quantity : 1 Form : Powder Application : Other, Used in coatings, lithium battery binders, membranes, engineering plastics, and chemical equipment Molecular Weight : (106)n Shape : Other, Powder Main Material : Poly(vinylidene fluoride) Storage : Other, Store in cool, dry place, keep container tightly closed Usage : Industrial, battery manufacturing, membrane making, coating material Chemical Name : Poly(vinylidene fluoride) Classification : Other, Fluoropolymer Melting Point : Approx. 170175C Other Names : PVDF Molecular Formula : (C2H2F2)n Standard : GB/T 182512000 Structural Formula : (CH2CF2)n Poisonous : Yes Solubility : Insoluble in water, soluble in polar solvents such as dimethylformamide and dimethylacetamide Grade : Industrial Grade Purity : 99% Smell : Other, Odorless Density : 1.78 Gram per cubic centimeter(g/cm3) HS Code : 39046900 Type : Polymer Powder CAS No : 24937799 Boiling point : Decomposes before boiling EINECS No : 2520484 Refractive Rate : 1.42 Ph Level : Neutral

Abrasive strips - Aluminium Oxide Form : Solid Application : Other, Deburring, finishing, and smoothing of metal, wood, composite, and dental applications Molecular Weight : 101.96 g/mol Shape : Other, Strip Main Material : Aluminium Oxide (Al2O3) Storage : Other, Store in a cool, dry place Usage : Abrasive surface preparation Chemical Name : Aluminium Oxide Classification : Other, Abrasive Melting Point : 2072C (approx) Other Names : Alumina, Corundum Molecular Formula : Al2O3 Standard : Industrial Grade Structural Formula : Al2O3 Poisonous : Yes Solubility : Insoluble in water Grade : Other, Industrial Purity : 99% (Al2O3 content) Smell : Other, Odourless Density : 4.1 Gram per cubic centimeter(g/cm3) HS Code : 68053000 Type : Abrasive Strip CAS No : 1344281 Boiling point : 2977C (approx) EINECS No : 2156916 Refractive Rate : 1.761.77

Kemet diamond polishing paste Form : Other, Paste Application : Other, Polishing, lapping and finishing of hard materials including metals, ceramics, and composites Molecular Weight : 12.01 g/mol (diamond) Shape : Other, Paste (contains micronsized diamond particles) Main Material : Diamond abrasive (synthetic diamond powder in a paste base) Storage : Other, Store in a cool, dry place. Avoid direct sunlight and contamination. Usage : Surface finishing, mold polishing, metallographic preparation, precision tool and die finishing Chemical Name : Diamond Polishing Paste Classification : Other, Abrasive compound Melting Point : Not applicable (paste) Other Names : Kemet Diamond Paste, diamond lapping paste Molecular Formula : C (diamond) Standard : Complies with industrial and metallography standards Structural Formula : C (diamond lattice) Poisonous : Yes Solubility : Water and oil soluble (available as W or O types) Grade : Other, Available in various micron grades (e.g., 1, 3, 6, 15, 30 micron) Purity : Typically high purity (up to 99% diamond content in abrasive part) Smell : Other, Odorless or mild base odor Density : 3.5 Gram per cubic centimeter(g/cm3) HS Code : 34053000 Type : Diamond polishing paste CAS No : 7440440 (diamond) / mixture Refractive Rate : 2.42 (diamond itself) Ph Level : Neutral

Formvar on 3mm 75 Mesh Cu Grids (Pack of 25) Form : Other, Mesh grid coated with Formvar film Application : Other, Support film for electron microscopy, particularly transmission electron microscopy (TEM) Molecular Weight : Variable (polymer), 63.55 for copper Shape : Other, Disc (grid), thin film coated Main Material : Copper (Cu) grid with Formvar polymer coating Storage : Other, Store at room temperature, dry environment Usage : Used as a specimen support in TEM sample preparation Chemical Name : Polyvinyl formal (Formvar), Copper grid Classification : Other, Polymer film on metal grid Melting Point : Approximately 170C Other Names : Polyvinyl formal on copper grid Molecular Formula : (C3H4O)x for polymer; Cu for grid Standard : Meets electron microscopy lab standards Structural Formula : [CH2CH(OCH3)CH2O]n for Formvar, Cu lattice Poisonous : Yes Solubility : Insoluble in water; soluble in organic solvents such as chloroform and ethylene dichloride Grade : Other, Analytical/Research grade Purity : Highpurity Formvar and copper Smell : Other, Odorless Density : 1.2 Gram per cubic centimeter(g/cm3) HS Code : 810 copper mesh / 3916 polymer film Type : 3mm diameter, 75 mesh copper grid coated with Formvar CAS No : 63148652 (Formvar polymer) EINECS No : N/A (Formvar is a trade name)