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Copper Conductor Paste

Copper Conductor Paste

550 INR/Bottle

Product Details:

  • Smell Slight, characteristic
  • Structural Formula Cu
  • Poisonous Yes
  • Solubility Insoluble in water, dispersible in some organic solvents
  • Taste Odorless, not for ingestion
  • Density 9.0 Gram per cubic centimeter(g/cm3)
  • Ph Level Neutral
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Copper Conductor Paste Price And Quantity

  • 1 Gram
  • 550 INR/Bottle
  • 850C 900C (for certain applications)
  • Reddish brown
  • 60,000-150,000 cps
  • 6-12 months (if unopened)
  • <5 microns (Copper particles)
  • Contains no lead, RoHS compliant
  • Non-hazardous under normal use
  • 120C 150C (typical)
  • <30 cm (after firing)
  • Compatible with screen and stencil printing
  • Strong adhesion to ceramics and glass
  • 10-30 minutes, depending on temperature
  • Available in 50g, 100g, 500g, 1kg, customized sizes
  • Specific organic solvent blend or as specified by manufacturer

Copper Conductor Paste Product Specifications

  • Conductive paste
  • Conductive Inorganic Compound Paste
  • 2567C (Copper)
  • Electronics/Industrial
  • Printed electronics and thick film conductor applications
  • Cu + Additives
  • Conductive circuits, electronic components, PCB printing, heating elements
  • 63.55 (Copper only)
  • Cu Paste, Copper Conductive Paste
  • Paste
  • 9.0 Gram per cubic centimeter(g/cm3)
  • Odorless, not for ingestion
  • Insoluble in water, dispersible in some organic solvents
  • Yes
  • Copper
  • 231-159-6
  • Cu
  • Slight, characteristic
  • 1085C approx (Copper base)
  • Industrial/ROHS compliant
  • 99% Copper content approx
  • 7440-50-8 (Copper)
  • Copper Conductor Paste
  • Store in cool, dry place, tightly closed
  • Paste/Thick slurry
  • Neutral
  • 32081090
  • 850C 900C (for certain applications)
  • Reddish brown
  • 60,000-150,000 cps
  • 6-12 months (if unopened)
  • <5 microns (Copper particles)
  • Contains no lead, RoHS compliant
  • Non-hazardous under normal use
  • 120C 150C (typical)
  • <30 cm (after firing)
  • Compatible with screen and stencil printing
  • Strong adhesion to ceramics and glass
  • 10-30 minutes, depending on temperature
  • Available in 50g, 100g, 500g, 1kg, customized sizes
  • Specific organic solvent blend or as specified by manufacturer

Product Description

Copper Conductor Paste Description

Copper Conductor Paste is generally immediately available in most volumes. High purity, submicron and nanopowder forms may be considered. Nanochemazone produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available, as is additional technical and safety (MSDS) data. Please contact us for information on lead time and pricing above.



Superior Conductivity for Precision Applications

With a post-firing electrical resistivity of less than 30 cm, this copper conductor paste ensures reliable electrical connections for printed circuits and electronics. It is finely engineered with high copper purity and a dense formulation, making it ideal for precision applications including PCB fabrication, heater elements, and advanced electronic components.


Easy Processing and Application

The paste's rheology-with viscosity ranging from 60,000 to 150,000 cps-ensures compatibility with both screen and stencil printing. It dries quickly at 120C-150C and cures efficiently at higher temperatures when required. This makes it convenient for manufacturers aiming to streamline production while maintaining high performance and consistent results.


Environmentally Responsible and Safe

Composed of non-toxic, lead-free materials, this copper paste is RoHS compliant and considered non-hazardous under normal usage conditions. Its shelf life of 6-12 months-when stored in a cool, dry, tightly sealed container-ensures minimal waste and safe handling, meeting rigorous industry and environmental standards.

FAQ's of Copper Conductor Paste:


Q: How is Copper Conductor Paste typically applied to electronic components or PCBs?

A: Copper Conductor Paste is designed for convenient application using screen or stencil printing methods. Its specific viscosity and fine particle size make it ideal for producing precise and uniform conductive patterns on ceramics, glass, and compatible substrates.

Q: What are the key processing steps after applying the paste?

A: After application, the paste should be dried at 120C-150C for 10-30 minutes, depending on the desired curing speed and temperature. For optimal electrical performance and adhesion, a firing step at 850C-900C is recommended for certain applications, particularly for thick film circuits.

Q: When should the firing process be used, and what is its benefit?

A: The firing process is necessary when the application requires very low electrical resistivity and robust adhesion, such as in thick film electronic circuits. Firing at 850C to 900C ensures the copper particles sinter correctly, resulting in superior conductivity and mechanical strength.

Q: Where should the Copper Conductor Paste be stored to ensure maximum shelf life?

A: To maintain quality, store the paste in a tightly closed container in a cool, dry environment. When properly stored, it retains its properties for 6-12 months unopened.

Q: What benefits does Copper Conductor Paste offer over alternative conductor pastes?

A: With its strong adhesion to various substrates, ultra-low resistivity after firing, lead-free and RoHS compliant formulation, and environmental safety, this paste is both high-performing and compliant with modern industry standards. Its fine particle size also enables precise electronic printing.

Q: How can the paste's viscosity or application characteristics be adjusted?

A: If needed, the paste's application characteristics can be modified using the specific organic solvent blend recommended by the manufacturer. This allows adjustment of viscosity for different equipment or pattern requirements without compromising performance.

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