Wafer-Mount Adhesives

Product Description

Wafer-Mount Adhesives

Wafer-Mount 559 is a semi-rigid, solvent resistant plastic film with a pressure sensitive soluble adhesive layer.

Wafer-Mount 562 is a thermoplastic film adhesive used for temporary bonding of delicate crystals, metallurgical specimens, glass components and ceramic substrates for dicing, slicing, drilling and polishing. It is especially suited to making TEM cross-sections. It can be easily washed away using various solvents such as 1,1,1-trichloroethylene or specially formulated Wafer-Mount 562-S stripper.

Superior Adhesion & Easy Release

Wafer-Mount Adhesives provide robust peel strength and superior tensile support for secure wafer mounting in demanding semiconductor manufacturing. Their design enables easy peel-off, preventing residue accumulation on sensitive substrates. This combination ensures both high performance during processing and gentle removal during final stages, protecting wafer quality.


Stability and Compatibility

Engineered for thermal stability up to 200C and boasting high dielectric and moisture resistance, these adhesives perform reliably in various environmental conditions. Their compatibility with a range of materialsincluding silicon, gallium arsenide, sapphire, and multiple substratesmakes them a versatile choice for processes like dicing, mounting, and photolithography.


Environmental Safety & Standards

The adhesives comply with SEMI and RoHS standards, are non-toxic, and contain no assigned CAS or EINECS numbers. Formulated as solid, odorless films, rolls, or sheets, their storage is straightforward simply keep in a cool, dry place away from sunlight. This ensures operational safety and ease throughout semiconductor production.