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Silicon Wafer Undoped

Silicon Wafer Undoped

3500 INR/Pack
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Product Details:

  • Purity 99.999% (5N)
  • Strength High (Brittle solid)
  • Hardness Mohs 7
  • Product Type Undoped Silicon Wafer
  • Material Undoped Silicon
  • Alloy None (Monocrystalline Silicon)
  • Shape Round wafer
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Silicon Wafer Undoped Price And Quantity

  • 3500 INR/Pack
  • 1 , , Pack

Silicon Wafer Undoped Product Specifications

  • Undoped Silicon
  • 100 mm diameter x 525 m thickness
  • Semiconductor research, microelectronics, MEMS, R&D
  • Undoped Silicon Wafer
  • None (Monocrystalline Silicon)
  • 99.999% (5N)
  • High (Brittle solid)
  • < 0.01% (virtually moisture free)
  • Round wafer
  • Mohs 7
  • Si (Undoped high-purity monocrystalline silicon)
  • Grey

Silicon Wafer Undoped Trade Information

  • 1000-10000 , , Pack Per Day
  • 2-3 Days
  • All India

Product Description

Product NameSilicon Wafer Undoped
Product CodeNCZ-WM-0011
CAS7440-21-3
Diameter4 (100 mm), also available in 2, 3, 5, 6, 12
DopingUndoped
Crystal Orientation<100> other orientations are also possible
SurfaceSingle/Both Side Polished
Thickness500 m / Ask for customization
Resistivity1-10 ohm-cm
Crystal methodCZ
RRG12 %
Oxygen Contents12.5-16.5 ppm
Carbon Contents1 ppm


Superior Material for Advanced Applications

Undoped silicon wafers with <100> orientation and intrinsic resistivity are ideal for semiconductor research, microelectronics, and MEMS development. Their high purity and double-side polished surface guarantee consistent performance for intricate and sensitive experiments.


Precision Flatness and Surface Quality

With a flatness of 5 m and surface roughness not exceeding 1 nm, these wafers are manufactured to exacting standards. This ensures reliable layer deposition and device fabrication, minimizing defects and maximizing reproducibility in research outcomes.


Package Integrity and Moisture Control

Each wafer is vacuum sealed and cleanroom packed, maintaining its ultra-low moisture content (<0.01%). This process preserves the wafers integrity during transit and storage, crucial for delicate semiconductor processes and long-term reliability.

FAQs of Silicon Wafer Undoped:


Q: How is the surface quality of these Silicon Wafers maintained during shipment?

A: Each wafer is vacuum sealed and cleanroom packed, ensuring the surface remains virtually moisture-free and free from contaminants. This method is vital for safeguarding the double-side polished finish and maintaining a surface roughness of 1 nm.

Q: What makes this undoped silicon wafer suitable for research purposes?

A: The intrinsic resistivity (>1000 cm) and purity of 99.999% (5N) make it ideal for semiconductor, microelectronics, and MEMS research. These characteristics support accurate experimental measurements and high-precision device fabrication.

Q: When is a wafer with <100> crystal orientation preferred over other orientations?

A: The <100> orientation is frequently chosen for microelectronics and MEMS due to its enhanced electron mobility and predictable etch rates, making it well-suited for many standard semiconductor processes and device structures.

Q: Where can these silicon wafers be applied in industrial and research settings?

A: These wafers are widely used by manufacturers, exporters, importers, producers, retailers, suppliers, and traders in India, mainly for R&D, semiconductor device development, and fabrication of MEMS and microelectronic components.

Q: What is the process for evaluating the flatness and roughness of this wafer?

A: Sophisticated metrology tools are used to assess flatness ( 5 m) and surface roughness ( 1 nm). Such precise measurements ensure the wafer meets the prime grade criteria essential for high-performance semiconductor fabrication.

Q: How does the high thermal expansion coefficient affect its usage?

A: With a thermal expansion coefficient of 2.6 x 10^-6 /K, the wafer demonstrates good thermal stability up to 1250C, supporting processes that require high-temperature treatments without significant deformation or cracking.

Q: What benefits do double-side polished undoped wafers offer for microelectronic and MEMS fabrication?

A: Double-side polished wafers provide superior surface symmetry and minimal roughness, facilitating consistent thin film deposition, minimizing contamination risk, and enabling advanced device architectures in semiconductor manufacturing.

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