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SILICON WAFER UNDOPED SILICON WAFER UNDOPED
SILICON WAFER UNDOPED
SILICON WAFER UNDOPED

SILICON WAFER UNDOPED

3500 INR/Pack
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Product Details:

  • Strength High mechanical strength
  • Purity 99.999% (5N)
  • Hardness Mohs 7
  • Product Type Undoped Silicon Wafer
  • Material Single Crystal Silicon (Monocrystalline)
  • Alloy None (Pure silicon)
  • Shape Wafer / Circular Disc
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SILICON WAFER UNDOPED Price And Quantity

  • 3500 INR/Pack
  • 1 , , Pack

SILICON WAFER UNDOPED Product Specifications

  • Diameter: 2-6 inch, Thickness: 300-700 micron (custom sizes available)
  • Mohs 7
  • Wafer / Circular Disc
  • High mechanical strength
  • 99.999% (5N)
  • Semiconductor research, MEMS, Sensor fabrication, Photovoltaic R&D
  • Single Crystal Silicon (Monocrystalline)
  • <0.05% (after proper storage)
  • Grey / Mirror Finish
  • None (Pure silicon)
  • Undoped Silicon Wafer
  • High purity silicon (Si), undoped

SILICON WAFER UNDOPED Trade Information

  • 1000-10000 , , Pack Per Day
  • 2-3 Days
  • Yes
  • Sample costs shipping and taxes has to be paid by the buyer
  • All India

Product Description

Crystal Orientation<100> other orientations are also possible
SurfaceSingle/Both Side Polished
Thickness500 m / Ask for customization
Resistivity1-10 ohm-cm
Crystal methodCZ
RRG12 %
Oxygen Contents12.5-16.5 ppm
Carbon Contents1 ppm


Precision Engineering & Quality Assurance

Each silicon wafer is engineered to meet stringent dimensional tolerances, with a diameter tolerance of 0.2 mm and thickness tolerance of 10 microns. The purity level is maintained at 99.999% (5N), verified through rigorous quality controls to ensure performance across research, laboratory, and industrial settings. Our wafers are suitable for the most demanding applications.


Double Side Polished Mirror Finish for Optimal Performance

Our double-side polished, mirror-finished wafers offer an ultra-smooth surface roughness below 1 nm (Ra), making them ideal for technology fields requiring impeccable surface integrity. This superior finish enhances device yield and reliability, supporting precision-dependent work in semiconductor and MEMS research.


Vacuum Sealed Packaging with ESD Protection

To ensure pristine quality, each wafer is vacuum-sealed in packaging designed to shield against electrostatic discharge (ESD) and moisture ingress. This preserves the wafers electrical and physical attributes during storage and transit, benefitting both local and international customers across India.

FAQs of SILICON WAFER UNDOPED:


Q: How are the undoped silicon wafers manufactured to achieve high purity and mirror finish?

A: The wafers are produced by growing single crystal silicon using the Czochralski or Float Zone method, ensuring purity of 99.999% (5N). Both sides are then precision-polished to a mirror finish with surface roughness less than 1 nm (Ra), making them suitable for demanding electronic and research applications.

Q: What applications are these undoped silicon wafers most commonly used for?

A: These wafers are extensively used in semiconductor research, MEMS and sensor fabrication, and photovoltaic R&D. Their high resistivity and intrinsic nature make them ideal for applications requiring low electrical conductivity and superior surface quality, such as device prototyping and material science experiments.

Q: When should I choose a wafer with <100> or <111> crystal orientation?

A: The choice depends on the intended process or application. <100> oriented wafers are preferred for most standard semiconductor device fabrication due to their easy cleavage and lower defect density, while <111> orientation is favored in applications requiring specific electronic or etching characteristics, such as MEMS structures.

Q: Where are these silicon wafers typically supplied from and how are they packaged?

A: Both domestic and international orders are fulfilled from India. Each wafer is vacuum-sealed with ESD protection to ensure safe handling during transit and prevent contamination and moisture exposure until use.

Q: What benefits does the double side polished (DSP) surface provide over single side polishing?

A: Double-side polishing ensures ultra-flatness and parallelism on both surfaces, reducing the risk of particle contamination and enabling uniform thin film deposition or photolithography from either side. This is especially beneficial in applications needing exceptional surface integrity.

Q: How should I store the wafers to maintain their quality and moisture level?

A: Store the wafers in their original vacuum-sealed packaging at room temperature in a dry, clean environment. This prevents exposure to air and moisture, maintaining a moisture level below 0.05% and optimal surface condition until usage.

Q: What is the advantage of choosing high mechanical strength and rolled/beveled edge design for these wafers?

A: The rolled or beveled edge design enhances mechanical strength and reduces edge chipping or breakage during handling and processing, ensuring safer operation and reducing material losses for manufacturers and researchers alike.

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