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Tin Lead Alloy Nanopowder

Tin Lead Alloy Nanopowder

450 INR/Bottle

Product Details:

  • HS Code 80070090
  • Shape Spherical nanoparticles
  • Density 8.5 Gram per cubic centimeter(g/cm3)
  • Other Names Solder Nanopowder, Sn-Pb Nanoparticles
  • Storage Store in a cool, dry, airtight container
  • Smell Odorless
  • Molecular Weight Depends on Sn/Pb ratio
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Tin Lead Alloy Nanopowder Price And Quantity

  • 1 Gram
  • 450 INR/Bottle

Tin Lead Alloy Nanopowder Product Specifications

  • Yes
  • Tin-Lead Alloy Nanoparticles
  • 231-141-8 (Sn), 231-100-4 (Pb)
  • Conforms to industrial/electronic standards
  • Intermetallic phase mixture
  • >99%
  • Metal Alloy Nanoparticle
  • Sn-Pb
  • Over 1500°C (varies by composition)
  • Insoluble in water, soluble in acids
  • Neutral
  • 183°C (typical, varies slightly depending on Sn/Pb ratio)
  • Powder
  • Tasteless
  • Nanopowder
  • Solder Nanopowder, Sn-Pb Nanoparticles
  • 80070090
  • Spherical nanoparticles
  • 8.5 Gram per cubic centimeter(g/cm3)
  • Not applicable (mixture), Tin: 7440-31-5, Lead: 7439-92-1
  • Odorless
  • Industrial, Electronic
  • Store in a cool, dry, airtight container
  • Tin-Lead Alloy
  • Electronics soldering, semiconductor, metallurgy, research
  • Used for joining electrical components, nano-additive in material science
  • Depends on Sn/Pb ratio
  • Excellent electrical and thermal conductivity
  • Non-magnetic
  • Harmful if swallowed or inhaled; handle with protective equipment
  • Sealed bottles or vacuum packaging
  • Typically 60:40, customizable
  • >30 m²/g
  • 1 year in sealed packaging
  • Grey to black fine powder
  • <100 nm

Product Description

Tin Lead Alloy Nanopowder

MF: Sn:Pb
Chemical Name:

Tin Lead Alloy Nanopowder

Purity: > 99.99%
APS: 80-100 nm (Size Customization possible)
Form: Nanopowder
Product Number: NCZA135
CAS Number: 7440-31-5 / 7439-92-1

Tin Lead Alloy Nanopowder Description

Typical and custom packaging is available. Additional technical, research and safety (MSDS) information is available as is a Reference Calculator for converting relevant units of measurement.



High-Precision Nanopowder for Advanced Applications

Tin Lead Alloy Nanopowder is engineered for excellence in applications like electronics, semiconductor manufacturing, metallurgy, and research. Its customizable Sn:Pb ratio, high surface area, and fine particle size offer unmatched performance for precise soldering and as a nano-additive in material science. This product conforms to industrial and electronic standards, ensuring consistent quality and superior conductivity.


Comprehensive Safety and Handling Guidelines

Due to its lead content, the nanopowder is toxic if ingested or inhaled. Always wear suitable respiratory and skin protection when handling this material. Store it in sealed bottles or vacuum packaging, in a cool, dry place, to maintain integrity and prolong shelf life. Proper handling supports a safe working environment and preserves material performance during use and storage.

FAQ's of Tin Lead Alloy Nanopowder:


Q: How is Tin Lead Alloy Nanopowder typically used in electronics and material science?

A: This nanopowder is widely utilized for joining electrical components during soldering in electronics, as well as functioning as a nano-additive in advanced material science research due to its exceptional conductivity and reactivity brought by its fine particle size.

Q: What are the safety precautions when handling Tin Lead Alloy Nanopowder?

A: It is essential to use personal protective equipment, including gloves and masks, to avoid inhalation or ingestion, as the powder is harmful and toxic due to its lead content. Handle only in well-ventilated areas and avoid direct skin contact.

Q: Where should I store the Tin Lead Alloy Nanopowder to maximize its shelf life?

A: Store the nanopowder in an airtight container, such as a sealed bottle or vacuum packaging, in a cool and dry environment. Proper storage prevents oxidation and maintains quality for up to one year.

Q: What benefits does the <100 nm particle size offer in practical applications?

A: The ultra-fine particle size increases surface area, leading to improved wettability and enhanced bonding during electronics soldering. This results in finer, more reliable joins and better integration into advanced composites.

Q: When should I consider customizing the Sn:Pb ratio in this nanopowder?

A: Customizing the tin-to-lead ratio is beneficial when adapting the alloy's melting point or electrical performance to specific application requirements in electronics or metallurgy.

Q: Can Tin Lead Alloy Nanopowder be dissolved in water for processing?

A: No, this nanopowder is insoluble in water but can be dissolved in certain acids during processing or recycling stages if required by your industrial procedures.

Q: What standards does this nanopowder conform to for industrial and electronic use?

A: The Tin Lead Alloy Nanopowder meets typical industrial and electronic grade standards, ensuring suitable properties and high purity for professional applications in Canada and internationally.

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