Silver Paste

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Product Details:

Smell Odorless
Form Viscous paste
HS Code 32159090
Molecular Weight 107.87 g/mol
Storage Store in a cool, dry place, tightly sealed
Density 10.49 Gram per cubic centimeter(g/cm3)
Boiling point 2212C
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Silver Paste Product Specifications

Shape Paste
Application Used for electronic components, solar cells, thick film circuits, and conductive adhesives
Classification Inorganic Compound
Other Names Silver Conductive Paste
Main Material Silver
Chemical Name Silver
Structural Formula Ag
Purity 99.9%
Usage Industrial
Standard Industry standard
Type Conductive Paste
EINECS No 231-131-3
Form Viscous paste
Smell Odorless
Molecular Weight 107.87 g/mol
HS Code 32159090
Storage Store in a cool, dry place, tightly sealed
Density 10.49 Gram per cubic centimeter(g/cm3)
Boiling point 2212C
Solubility Insoluble in water
Melting Point 961.8C
CAS No 7440-22-4
Grade Technical Grade
Taste Odorless
Molecular Formula Ag
Poisonous Yes

Silver Paste Trade Information

Payment Terms Paypal, Telegraphic Transfer (T/T), Cash in Advance (CID), Cheque, Cash Advance (CA)
Main Domestic Market All India

Product Description

Linear Formula:	Ag
Chemical Name:	Silver Paste
Molecular Weight:	107.87
Melting Point:	960 ºC
Boiling Point:	2212 ºC
Product Number:	NCZ-P-111
Appearance:	Off-White to dark beige paste
CAS No:	7440-22-4

Exceptional Electrical Conductivity

Formulated with 99.9% pure silver particles, Silver Paste delivers superior conductive performance for industrial electronics. Its low resistivity ensures optimum signal transmission, making it suitable for demanding applications in circuit design and electronic assembly.

Versatile Substrate Compatibility

With its organic polymer binder, this paste ensures robust adhesion on ceramic, glass, plastic, and metal surfaces. This flexibility allows manufacturers to use it across varied production lines, including solar panel assembly and advanced electronic components.

Reliable Coverage and Easy Application

Silver Paste is engineered for high-efficiency coverage, allowing 20-25 m per kilogram. Its viscous consistency aids precise placement and minimal spread, while the recommended drying condition of 150C for 10 minutes guarantees uniform curing without compromising conductivity.

FAQs of Silver Paste:

Q: How is Silver Paste applied to electronic components or circuit substrates?

A: Silver Paste is typically dispensed onto prepared substrates such as ceramic, glass, plastic, or metal using screen printing, dispensing, or brushing. The paste should be cured at 150C for 10 minutes to ensure optimal adhesion and conductivity.

Q: What benefits does Silver Paste provide in the manufacture of solar cells or thick film circuits?

A: Silver Paste offers excellent electrical conductivity (10 mcm), strong adhesion, and high purity, ensuring efficient energy transfer and reliable circuit performance. Its compatibility with various substrates supports versatile manufacturing needs.

Q: When should I use Silver Paste over other conductive adhesives?

A: You should choose Silver Paste for applications requiring exceptional electrical conductivity, stability, and long-term reliabilitysuch as electronic components, solar cells, and thick film circuitsespecially when bonding to ceramic, glass, plastic, or metal surfaces.

Q: Where should Silver Paste be stored to maintain its shelf life?

A: Silver Paste should be stored tightly sealed in a cool, dry place away from direct sunlight and humidity to preserve its consistency and efficiency for up to 12 months.

Q: What is the process for curing Silver Paste after application?

A: After applying the paste, cure it by heating at 150C for 10 minutes. This ensures complete drying and strong adhesion while activating its conductive properties.

Q: How does the organic polymer binder affect the performance of Silver Paste?

A: The organic polymer binder enables strong adhesion to a variety of substrates, such as ceramics, metals, glass, and plastics, while maintaining the pastes flexibility and conductivity under industrial conditions.

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