Platinum Gold Conductor Paste

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Product Details:

Melting Point >1000C
Purity Typically >99% (metals content)
Storage Store in a cool, dry place, tightly sealed
Poisonous Yes
Molecular Weight Not applicable (mixture)
Other Names PtAu Conductor Paste
Solubility Insoluble in water
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Platinum Gold Conductor Paste Product Specifications

Molecular Formula Not applicable (mixture)
HS Code 321590
Shape Paste
Type Conductor Paste
Structural Formula Not applicable (mixture)
Application Used for metallization in electronic components, thick film circuits, chip resistors, and hybrid microelectronics
Density 13 Gram per cubic centimeter(g/cm3)
Form Viscous Paste
Smell Mild organic odor
Refractive Rate Not determined
Ph Level Neutral to slightly acidic
Classification Precious Metal Conductor Paste
Boiling point Not applicable (paste)
Purity Typically >99% (metals content)
Chemical Name Platinum Gold Alloy Paste
Melting Point >1000C
Usage Screen printing on ceramics or dielectric substrates
Poisonous Yes
Storage Store in a cool, dry place, tightly sealed
Molecular Weight Not applicable (mixture)
Other Names PtAu Conductor Paste
Standard Industry Standard for thick film pastes
Main Material Platinum, Gold, Glass Frit, Organic Vehicle
Grade Electronic Grade
Solubility Insoluble in water

Platinum Gold Conductor Paste Trade Information

Payment Terms Cash Advance (CA), Paypal, Telegraphic Transfer (T/T), Cash in Advance (CID), Cheque
Main Domestic Market All India

Product Description

Capitalise on the preeminent Platinum Gold Conductor Paste, an unmatchable solution for advanced metallization in electronic manufacturing. This enviable paste, formulated from high-purity platinum and gold alloys, offers excellent adhesion on alumina, ceramics, and glass substrates. With a firing temperature between 850C and 950C, and screen-printable viscosity for streamlined application, industries can procure consistent, superior results. Its low resistivity (<50 cm) and RoHS-compliant, lead-free composition guarantee both performance and environmental safety. Offered in multiple container sizes, this conductor paste embodies reliability and technological advancement.

Platinum Gold Conductor Paste: Applications & Surfaces

Platinum Gold Conductor Paste serves as a specialized material for thick film circuits, chip resistors, and hybrid microelectronics. Its unmatchable bonding with alumina, glass, and various ceramic substrates ensures reliable electronic performance. Suitable for screen printing, the paste is used for metallization of dielectric surfaces, capitalizing on its precise particle size and superior adhesion. Ideal for electronics manufacturing and research, it provides both general and specific solutions for conductive pathway creation in high-demand environments.

Payment, Arrival, and Supply for Platinum Gold Conductor Paste

Payment terms for the Platinum Gold Conductor Paste are competitive, tailored to your procurement needs, with the asking price reflecting its premium formulation. Swift delivery is prioritized, with secure shipping guaranteeing product integrity upon arrival. We maintain consistent supply ability, ensuring bulk and customized orders are fulfilled reliably and promptly. From manufacturer to exporter, every step is monitored to offer an efficient purchase process and timely access to this enviable material for your advanced applications.

Linear Formula:	Pt-Au
Chemical Name:	Platinum-Gold Conducting Paste
Purity:	>99.99%
Molecular Weight	NA
Melting Point	NA
Product Number:	NCZ-P-104
Appearance:	Thixotropic, Screen Printed Paste

FAQs of Platinum Gold Conductor Paste:

Q: How should the Platinum Gold Conductor Paste be applied to substrates?

A: The paste is screen printable and should be applied using standard screen printing techniques on compatible substrates such as alumina, ceramics, or glass. After application, it needs to be dried and fired within the recommended temperature range for optimal performance.

Q: What are the primary uses and application surfaces for this conductor paste?

A: This conductor paste is primarily used for metallization in electronic components, thick film circuits, chip resistors, and hybrid microelectronics. It exhibits excellent adhesion to alumina, various ceramics, and glass surfaces.

Q: When does the Platinum Gold Conductor Paste need to be used after opening?

A: For best results, the paste should be used within its shelf life of 6 months when kept unopened and stored in a cool, dry environment. After opening, ensure the container is tightly sealed to maintain quality.

Q: Where can I use compatible thinners with this product?

A: Solvent-based, compatible thinners can be used to adjust the viscosity of the paste if needed. Ensure that only recommended thinners are used to maintain product performance and avoid contamination.

Q: What are the benefits of using a lead-free and RoHS-compliant conductor paste?

A: Using a lead-free, RoHS-compliant paste supports safer working environments, aligns with global electronic industry standards, and ensures products are suitable for export to regions with strict environmental regulations.

Q: How long does the drying and firing process take for optimal results?

A: After screen printing, the paste typically dries within 1015 minutes at 120C. Firing should be performed between 850C and 950C to achieve the desired low resistivity and bond strength.

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